| 发明名称 |
MULTI-LAYER SUBSTRATE FOR PRINTED CIRCUIT. |
| 摘要 |
<p>A multi-layer substrate for printed circuit which has a pattern (6) for reconstruction in an inner layer, wherein the pattern (6) for reconstruction is connected to bonding pads (3g, 3h) for reconstruction on the surface through the intermediary of through holes (5e, 5f).</p> |
| 申请公布号 |
EP0203203(A1) |
申请公布日期 |
1986.12.03 |
| 申请号 |
EP19850906086 |
申请日期 |
1985.11.28 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KUWABARA, KIYOSHI;NISHIHARA, MIKIO |
| 分类号 |
H05K3/46;H05K1/00;H05K1/11;H05K3/22;(IPC1-7):H05K1/02 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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