发明名称 CARRYING METHOD FOR SEMICONDUCTOR WAFER
摘要 PURPOSE:To reduce adhesion of dust to the surface of a wafer in an environment of vertically flowing clean air by keeping the wafer in the vertical posture while the waiting time in a cassette in the carrying process. CONSTITUTION:A forcing up hand 14a moves in the Y direction by a predetermined value in order to adsorb with vacuum the reverse of a wafer 9 and lift it out of a cassette, and then it forces the wafer 9 upwardly in the Z direction to locate it out of the cassette after adsorbing the same. Next, a carrying and recovering hand 25 adsorbs with vacuum the reverse of the wafer 9 forced out of the cassette to deliver the wafer 9 from the hand 14a to the hand 25, and then the hand 14a lowers to return to the origin. A carriage 22 carries the wafer 9 to just before a pre-alignment stage 3 with the wafer 9 in the adsorbed posture by the carrying and recovering hand 25. At this position, the hand 25 sucking the wafer 9 rotates around an orthogonal axis to the Z axis to get wafer 9 in the horizontal posture, and then delivers the wafer 9 to the pre-alignment stage 3 in accordance with expansion and contraction or the like of an arm 24.
申请公布号 JPS62196239(A) 申请公布日期 1987.08.29
申请号 JP19860033984 申请日期 1986.02.20
申请人 CANON INC 发明人 TOKUDA YUKIO
分类号 B65G47/90;B65G1/00;B65G1/04;B65G1/07;B65G1/16;B65G60/00;B65H1/28;B65H1/30;B65H3/32;B65H29/28;H01L21/67;H01L21/677;H01L21/68 主分类号 B65G47/90
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