| 摘要 |
PURPOSE:To obtain a module having high functions, by mounting a plurality of logic elements or a plurality of memory elements on module substrates, bonding these substrates in a plurality of layers in the up and down direction in an airtight manner through outer frames, and sealing the logic elements or the memory elements on the uppermost substrate with a cap plate in an airtight manner. CONSTITUTION:A plurality of logic elements 1, which undergo flip-chip bonding on a module substrate 2, are mutually connected by a multilayer interconnection in the module substrate 2. Signals are inputted and outputted through I/O pins 3. A plurality of memory elements 6, which undergo flip-chip bonding on a module substrate 7, are mutually connected by a multilayer interconnection in a module substrate 7. Signals are inputted and outputted through l/O pins 9. part of the I/O pins 3, which are soldered to holes 8, are mutually connected to the memory elements 6. A plurality of the memory elements 6 are sealed by the module substrate 2 and an outer frame 10 in an airtight manner. A plurality of logic elements 1 is sealed by a cap plate 4 in an airtight manner. Heat is dissipated through heat radiating fins 5. |
