Hot chuck assembly for integrated circuit wafers.

摘要

A hot chuck assembly (10) characterized by a platen (30) suspended over a base (12) by four, equally spaced mounting posts (60). The suspension points on the platen (30) are provided as close as possible to its upper, wafer support surface (32) so that thermal expansion of the platen (30 has a minimal effect on the position of a supported wafer. Each of the mounting posts (60) includes a pair of resilient leg portions (64/66) which can flex in a radial direction to absorb radial expansion or contraction of the platen (30). In consequence, the hot chuck assembly (10) of the present invention minimizes both lateral and axial displacement of a supported integrated circuit wafer as the platen (30) heats and cools.