Resin composition, chip-resistant coating composition containing it and coating process.

摘要

Resin compositions useful in formulating chip resistant coating compositions comprise an active-hydrogen containing compound composed of 100 parts by weight of polyol (A) and from 1 to 30 parts by weight of polyamine (B), and a blocked isocyanate (C) containing from 1 to 15 percent by weight of effective isocyanate groups in such amounts that the equivalent ratio of the sum of polyol (A) hydroxyl groups and polyamine (B) primary and/or secondary amino groups to the effective blocked isocyanate (C) isocyanate groups is from 50:100 to 100:50. Chip resistant coating compositions contain the resin compositions and pigments, catalysts and/or stabilizers, and may be applied to suitable substrates and baked at 120 to 200 DEG C, for example, to form coatings having a thickness of 100 mu m or more.