发明名称 BONDING APPARATUS
摘要 <p>A bonding apparatus, for example for a friction facings and carrier plate assembly for use in a friction clutch driven plate, comprises first and second platens (22, 70) which are mountable one over the other such that a first surface on one platen faces towards a first surface on the other platen. Each said first surface has an annular recess (30, 78) therein such that when the platens are mounted one on top of the other said annular recesses substantially coincide and are substantially co-axial. Each recess has a base (38, 84) with a substantially flat surface (40, 86) at the bottom of the recess, and each base has means such as apertures (92) or suction cups (104, 114) therein opening to the recess and connectable with a source of vacuum to apply vacuum to the recess. A pair of annular friction facings (10, 12) are bonded to opposite sides of a carrier plate (4) to form a friction facings and carrier plate assembly (2) by using the bonding apparatus to hold a respective annular friction facing (10, 12) flat against the base (38, 84) of a respective recess (30, 78) in each said platen (22, 70) by applying said vacuum in the course of a said carrier plate (4) disposed between the two platens being bonded to the friction facings by adhesive (14, 14') interposed between each friction facing and the carrier plate.</p>
申请公布号 WO1990003526(A1) 申请公布日期 1990.04.05
申请号 GB1989001143 申请日期 1989.09.27
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