| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method of a chuck table which can adequately remove a foreign matter on a holding surface.SOLUTION: A cutting device (2) includes: a chuck table (14) which has a holding surface (48a) which can be selectively connected to a suction source (52) and a fluid supply source (56), and sucks and holds a workpiece (11) by the holding surface; cutting means (18) which cuts the workpiece held on the chuck table; chuck table moving means which moves the chuck table in a cutting-feed direction; a nozzle (44) which is arranged over a movement path of the chuck table and jets a fluid (B) to the holding surface. In a cleaning method of the chuck table used in cleaning the chuck table of the cutting device, a foreign matter on the holding surface is removed by moving the chuck table so as to pass beneath the nozzle in a state that the holding surface is connected to the fluid supply source, a fluid (A) is jetted from the holding surface, and also the fluid is jetted from the nozzle.SELECTED DRAWING: Figure 3 |
