发明名称 HEATING APPARATUS FOR SEMICONDUCTOR WAFERS OR SUBSTRATES
摘要 <p>In a rapid thermal heating apparatus lamps (19) are disposed in a plurality of light pipes (21) arranged to illuminate and supply heat to a substrate (61). The light pipes (21) are positioned so that the illumination patterns overlap. The energy supplied to the lamps (19) is controlled to provide a predetermined heating pattern to the substrate (61). A liquid cooled window (17) cooperates with the light pipes (21) to transmit energy to a wafer (61) disposed in an evacuated chamber (13).</p>
申请公布号 WO1991010873(A1) 申请公布日期 1991.07.25
申请号 US1991000266 申请日期 1991.01.18
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