A flexible high density interconnect structure and flexibly interconnected system.

摘要

A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate (14) containing the chips (20) interconnected thereby. During fabrication, the flexible portion (39) of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it is sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.