| 摘要 |
A carrier tape and a method of manufacturing a semiconductor device employing the same. The carrier tape has an insulating film and a plurality of leads. The film has an opening for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the opening, a lead supporting portion positioned between the opening and the outer lead holes, and at least one tie bar separating a pair of mutually opposing outer lead holes. The tie bar divides the associated outer lead hole and is connected to the lead supporting portion to prevent the lead supporting portion from sagging. The plurality of leads of the carrier tape are supported on the lead supporting portion of the film, projecting into the opening of the film. During manufacture, a semiconductor chip having a plurality of electrodes is positioned within the opening, and the one end portion of each lead is electrically connected to one of the electrodes of the semiconductor chip. The chip and carrier tape are placed within a cavity of a mold, and resin is injected into the cavity along the tie bar.
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