| 摘要 |
A power device assembly comprises a circuit board sub-assembly and a protective housing enclosing the circuit board sub-assembly. The circuit board sub-assembly includes a heat sink frame around the periphery of a circuit board. Heat generating power devices and, optionally, other circuit devices are mounted in thermally conductive contact with the heat sink frame. Electrical leads extend from the power devices to the circuit board where a solder connection is formed. The heat sink frame extends outwardly beyond the circuit board, at least a portion extending outwardly from the protective housing to provide cooling means for the assembly. According to a method of the invention, a sub-assembly comprising the circuit board, heat sink frame and power device is assembled and the heat sink frame is used as a palette to support and carry the circuit board through a wave soldering process.
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