发明名称 |
Portable semiconductor apparatus |
摘要 |
The present invention makes it easier to connect board modules to each other and to increase reliability in a portable semiconductor apparatus having two board modules within a frame. Upper-row connection pins and lower-row connection pins have electrode leads, each having connection portions divided into two parts that are arranged in respective upper and lower rows. One of the board modules is inserted between one upper-row electrode lead and one lower-row electrode lead and electrically connected. The other board module is inserted between another upper-row electrode lead and another lower-row electrode lead and electrically connected. In this way, the board modules are electrically connected to each other.
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申请公布号 |
US5331516(A) |
申请公布日期 |
1994.07.19 |
申请号 |
US19930002056 |
申请日期 |
1993.01.08 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
SHINOHARA, TAKAYUKI;KIMURA, MASATOSHI |
分类号 |
B42D15/10;G06K19/077;H05K1/14;H05K5/02;H05K7/14;(IPC1-7):H01R23/68 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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