LEADFRAME FOR SEMICONDUCTOR DEVICE

摘要

The lead frame of a multi-pin quad flat package (QFP) has a ring pad (36) located between a die pad (32) and an inner lead (31), and supported by a tie bar (33). Ring pad has bonding pad (37) attached to it and is used for double-wire bonding between an electrode pad (39) and an inner lead (31). The invention lowers the defects like wire declining, short, or disconnection.