| 摘要 |
PROBLEM TO BE SOLVED: To provide a package capable of reducing a possibility of disconnection or resistance abnormality in a wiring conductor that is disposed in contact with a thin layer provided between a base part and a frame part or within the frame part when laminating insulation layers by applying a pressure, and an electronic apparatus.SOLUTION: A package 1 includes an insulation base 11 comprising: a base part 111; a frame part 112 which is provided on a principal surface of the base part 111 and formed from a plurality of insulation layers 11a each including an opening; and a thin layer 113 which is provided between the base part 111 and the frame part 112 or within the frame part 112 and thinner than the insulation layers 11a. A dent 113a that is recessed is provided outside of the thin layer 113 in the insulation base 11.SELECTED DRAWING: Figure 2 |
