发明名称 |
METHOD FOR MANUFACTURING RESIN-SEALED COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin-sealed component capable of manufacturing, by a simple method, a substrate-less resin-sealed component in which a component is sealed with a resin.SOLUTION: The present invention provides the method for manufacturing a resin-sealed component, which comprises: a preparation step of preparing an adhesive substrate which has a substrate and an adhesive layer formed on the substrate; a component arrangement step of arranging a component at a desired position on the adhesive layer of the adhesive substrate; a sealing step of sealing the component with a resin by using a mold to form a resin-sealed component on the adhesive substrate; and a peeling step of peeling the adhesive substrate from the resin-sealed component.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016207900(A) |
申请公布日期 |
2016.12.08 |
申请号 |
JP20150089763 |
申请日期 |
2015.04.24 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
TANIGUCHI TAKAHISA;INOUE MASAKUNI;MURAKAMI YUKA;TACHIKAWA TOMOYUKI;OTAKI HIROYUKI;MARUYAMA SATOSHI |
分类号 |
H01L21/56;B29C33/14;B29C39/10;B29C43/18;B29C45/14;C09J5/00;C09J7/02;C09J11/06;C09J133/04;C09J163/00;C09J201/00 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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