发明名称 METHOD FOR MANUFACTURING RESIN-SEALED COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin-sealed component capable of manufacturing, by a simple method, a substrate-less resin-sealed component in which a component is sealed with a resin.SOLUTION: The present invention provides the method for manufacturing a resin-sealed component, which comprises: a preparation step of preparing an adhesive substrate which has a substrate and an adhesive layer formed on the substrate; a component arrangement step of arranging a component at a desired position on the adhesive layer of the adhesive substrate; a sealing step of sealing the component with a resin by using a mold to form a resin-sealed component on the adhesive substrate; and a peeling step of peeling the adhesive substrate from the resin-sealed component.SELECTED DRAWING: Figure 1
申请公布号 JP2016207900(A) 申请公布日期 2016.12.08
申请号 JP20150089763 申请日期 2015.04.24
申请人 DAINIPPON PRINTING CO LTD 发明人 TANIGUCHI TAKAHISA;INOUE MASAKUNI;MURAKAMI YUKA;TACHIKAWA TOMOYUKI;OTAKI HIROYUKI;MARUYAMA SATOSHI
分类号 H01L21/56;B29C33/14;B29C39/10;B29C43/18;B29C45/14;C09J5/00;C09J7/02;C09J11/06;C09J133/04;C09J163/00;C09J201/00 主分类号 H01L21/56
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