Probe apparatus for measuring electrical characteristics of objects

摘要

A contact ring having probe pins is mounted in the top surface of a casing, and a wafer holder table is placed below the contact ring. A holder member comprising a longitudinally extended cylindrical body are provided in such a manner as to be free to move into and out of a space between the probe pins and the wafer holder table, parallel to the upper surface of a wafer and along guide rails protruding from a casing. An image of the probe pins which act as contact means and an image of the electrode pads of an IC chip on the wafer are input to a camera that is provided in the holder member. With the probe apparatus of the present invention, it is possible to position the wafer while viewing these images, and there is no need to provide a region for separate positioning. This facilitates the design of a smaller probe apparatus.