发明名称 |
Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
摘要 |
A laminated structure (1) comprising a substrate (3) and a polymer layer (5) is provided. The polymer layer consists of conductive areas (7) having a sheet resistance of maximally 1000 OMEGA /sqaure. The adjacent parts of the polymer layer are substantially non-conductive and have a sheet resistance which is a factor of 106 higher. An electrodeposited metal layer (9), for example of copper, is present on the conductive areas (7). A simple method of photochemically generating the conductive pattern (7) which can be reinforced in an aqueous metal-salt solution by electrodeposition of a metal layer (9) is also provided and most preferably the conductive pattern is inter alia, the patterned exposure of a layer of 3,4-ethylene dioxythiophene or polyaniline. The method can very suitably be used for the manufacture of metal patterns on insulating substrates, such as printed circuit boards.
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申请公布号 |
US5427841(A) |
申请公布日期 |
1995.06.27 |
申请号 |
US19940203104 |
申请日期 |
1994.02.28 |
申请人 |
U.S. PHILIPS CORPORATION |
发明人 |
DE LEEUW, DAGOBERT M.;MUTSAERS, CORNELIUS M. J.;SIMENON, MAURICE M. J. |
分类号 |
H05K1/03;C08G61/12;H01B1/12;H05K1/09;H05K3/18;(IPC1-7):B32B9/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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