| 发明名称 |
Packing structure for a semiconductor wafer container. |
| 摘要 |
<p>A packing structure for a container (2) for containing semiconductor wafers comprises a polypropylene box (1), and upper (4) and lower (3) pressing members for sandwiching the container (2) for containing semiconductor wafers. Both the upper and lower pressing members (4, 3) are formed from an olefinic resin such as polypropylene. <IMAGE></p> |
| 申请公布号 |
EP0682358(A2) |
申请公布日期 |
1995.11.15 |
| 申请号 |
EP19950300955 |
申请日期 |
1995.02.15 |
| 申请人 |
SHIN-ETSU HANDOTAI COMPANY LIMITED |
发明人 |
OINUMA, KENJI, C/O SEMICONDUCTOR ISOBE RES.INSTITE;YAMAGUCHI, KATSUAKI, C/O SEMICONDUCTOR ISOBE RES. |
| 分类号 |
B65D85/86;H01L21/673;(IPC1-7):H01L21/00;H05K9/00 |
主分类号 |
B65D85/86 |
| 代理机构 |
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代理人 |
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| 主权项 |
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