External lead bonding method and apparatus

摘要

A bonding method and apparatus for bonding leads of a solid-state device to leads of a lead frame includes a tool arm formed with first and second bonding sections. The first bonding section bonds external leads on two opposing sides of the solid-state device to leads of the lead frame, and then the second bonding section bonds external leads on other two opposing sides of the solid-state. When these bindings are performed, the solid-state device except for the external leads is not in touch with the bonding sections that are defined by pairs of ridges.