CONDUCTOR PASTE, MANUFACTURE THEREOF, AND CIRCUIT BOARD AND ELECTRONIC CIRCUIT MODULE USING IT

摘要

PURPOSE:To obtain excellent conductivity and long-term preserving property and high-density wiring, miniaturize a circuit board, and propagate signals at a high speed by constituting the thick layer circuit board with the conductor paste made of an organic vehicle containing the specific % of low-resistance high-melting point metal powder by the specific method. CONSTITUTION:Low-resistance high-melting point metal powder 85-90wt.% mainly consisting of tungsten and molybdenum and the remainder of an organic vehicle containing a binder 5-13wt.% are mixed, and the mixture is forcefully fed at the shear rate 1000s<-1> through the minimum interval section of a kneading machine having the minimum interval of at least 5mum and an larger interval around it and kneaded to obtain conducting paste 3. This paste 3 is pattern- printed on a green sheet 2 mainly made of ceramic and sintered to obtain a thick layer circuit board 1. Pins 12 and semiconductor elements 10 are soldered via connecting conductors 5 and 6 and a thin conductor 8 to complete an electronic circuit module.