摘要 |
After the sacrificial layer formation the substrate (10) top surface and that of the sacrificial layer are fitted, at least partly, with the inorganic useful layer (23) of a preset thickness which is smaller than that of the sacrificial layer. Then the latter, together with a part of the covering useful layer, is removed from the substrate. Then the substrate with the covering position of the useful layer is exposed to an etchant acting only on the substrate. Pref. the sacrificial layer is first deposited on the entire surface of the substrate and subsequently structured. The deposition can be carried out by centrifuging , immersion, or spraying. |
申请人 |
ROBERT BOSCH GMBH, 70469 STUTTGART, DE |
发明人 |
KUMMER, NILS, DIPL.-ING. (FH), 71642 LUDWIGSBURG, DE;MUELLER-FIEDLER, ROLAND, DIPL.-PHYS. DR., 71229 LEONBERG, DE;BUTH, JOERG, DIPL.-ING. (FH), 70839 GERLINGEN, DE |