Thermoplastic moulding compsn. with low residual monomer content

摘要

Thermoplastic moulding compsn. (I) contains (a) 10-100 wt.% copolymer (II) of 1,1-diphenylethylenes of formula (III) and styrenes of formula (IV); (b) 0-3000 ppm (III) and (c) 0-500 ppm (IV) w.r.t. (I); (d) 0-90 wt.% other polymers; and (e) 0-50 wt.% other additives and processing aids w.r.t. the total compsn.. R1, R2 = H or 1-22C alkyl; R3 = H or 1-4C alkyl; and a, b = 0, 1, 2, 3, 4 or 5. Also claimed are a method of producing the compsn. and block copolymers (IIa) of (III) and (IV).