发明名称 MOLDING METHOD AND MOLDING DEVICE
摘要 PURPOSE: To provide a molding method and a molding device wherein a position of a primary molded product is not shifted even by high-pressure injection in a forming mold by holding certainly the primary molded product in the secondary forming mold. CONSTITUTION: A primary molded product 91 having an engaging projection 93 and an engaging hole part 94 is molded by a first molding process wherein a synthetic resin raw material is made to flow in a molding die. The molded product 91 is transferred to a forming mold 111 by a transfer means. The engaging projection 93 and engaging hole part 94 of the molded product 91 are stopped by being engaged with an engaging groove 113 and an engaging shaft 115 of the forming mold 111, and the molded product 91 is fixed in the forming mold 111. A secondary formed product 92 having the molded product 91 built-in is formed by a secondary forming process wherein the synthetic resin material is made to flow in the forming mold 111.
申请公布号 JPH08118411(A) 申请公布日期 1996.05.14
申请号 JP19940284142 申请日期 1994.10.25
申请人 BANDAI CO LTD 发明人 NAKAMICHI KOSAKU;MIURA KAZUNORI;OOHIRA KEIJI
分类号 B29C33/12;B29C45/14;B29C45/16;(IPC1-7):B29C45/14 主分类号 B29C33/12
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