CONDUCTIVE MATERIAL AND CONDUCTIVE PASTE USING THIS CONDUCTIVE MATERIAL

摘要

PURPOSE: To provide a couductive material inexpensive and excellent in conductivity and migration resistance by using silver coated copper powder obtained by coating a specific amount of silver in a surface of flake-shaped copper powder having a specific grain size. CONSTITUTION: This conductive material contains silver coated copper powder coating a surface of flake-shaped copper powder of a 20μm or less mean grain size with 5 to 30wt.% silver relating to this copper powder. For instance, less than 30 to 100 pts.wt. this silver coated copper powder and 70 pts.wt. or less (except 0) flake-shaped silver powder of 30μm or less mean grain size are used so as to obtain 100 pts.wt. in total. It is preferable to coat the surface of copper powder with silver by an electroless plating method. Conductive paste is formed by mixing a binder and a solvent added to the conductive material.