发明名称 |
Package for integrated circuits |
摘要 |
In one form of the invention, a package for integrated circuits and devices (42), (46) is disclosed, the package including: a package base (44), the base having a first top surface; a layer of material (43) on the first top surface of the base (44) wherein the material (43) is patterned to cover a portion of the base, and wherein the layer of material (43) forms a substrate having a second top surface; a microstrip transmission line (45) on the second top surface; and a plastic encapsulant (50), wherein the encapsulant covers the first top surface of the base.
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申请公布号 |
US5536906(A) |
申请公布日期 |
1996.07.16 |
申请号 |
US19930097336 |
申请日期 |
1993.07.23 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HAAS, JR., GLEN R.;BARNETT, JR., JOHN E.;NELSON, STEPHEN R.;DARROW, DOUGLAS J.;BAGEN, SUSAN V.;BREIT, HENRY;FORSTER, JAMES |
分类号 |
H01L23/433;H01L23/495;H01L23/66;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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