Halbleiteranordnung mit Halterung und Verfahren zum Montieren von Halbleiteranordnungen mit Halterung

摘要

A semiconductor device unit includes a holder (3, 13, 63, 73, 83) having a plurality of holding parts (6, 16, 66, 76, 86), and a plurality of semiconductor devices (2, 21-23) held by the holding parts of the holder. Each of the semiconductor devices have a generally parallelepiped shape with top and bottom surfaces and at least one side surface provided with leads (5) which are exposed when the semiconductor device is held by the holding part of the holder.