MANUFACTURING METHOD OF SEMICONDUCTOR CHIP BUMP

摘要

forming a semiconductor substrate(31) stacked with a metal wire(34), an insulator(33), a passivation layer(35) and a barrier metal layer(36) in sequence to prepare a stacked semiconductor chip of the barrier metal layer on the metal wire; depositing a positive first photoresist(32) on top of the barrier metal layer to expose it; depositing a positive second photoresist(37) on top of the exposed first photoresist to expose a pattern mask on the opposite part to the metal wire; developing the first and the second photoresist to plate the developed region; and forming a bump(40) by etching the rest of the first and the second photoresist.