| 摘要 |
Encapsulation box of a grid of solder balls of an electronic chip board has an area for injection of the plastic protective coating positioned between two corners of the substrate. The prodn. comprises: taking an insulating circuit board; making a metallised design on one side of connections, contacts and transversing contacts; making a second metallised design on the second side of the substrate consisting of a grid of solder contacts for surface mounting and able to receive solder balls; making the electrical connections that pass through the circuit board between sides; mounting and securing the semiconductor devices; making an area of injection moulding on the first side of the substrate between two corners of the first design; moulding by the intermediary of the moulding injection area a protective plastic coating around the device and substantial part of the first side of the substrate, leaving exposed an area around the perimeter of the coating; remove excess plastic from the surface of the injection region after moulding is achieved. |
