发明名称 Verfahren für die Reparatur von Leiterbahn-Verbindungen
摘要 Circuit connections can be repaired with high accuracy and high reliability by peeling apart mutually connected circuit portions and placing a porous sheet of predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling liquid, removing the porous sheet containing unnecessary adhesive dissolved by the peeling liquid, while cleaning the circuit surface contacted with the peeling liquid, and connecting the cleaned circuit surface to a circuit surface via an adhesive.
申请公布号 DE69121750(T2) 申请公布日期 1997.01.02
申请号 DE1991621750T 申请日期 1991.03.26
申请人 HITACHI CHEMICAL CO., LTD., TOKIO/TOKYO, JP 发明人 GOTO, YASUSHI, SHIMODATE-SHI, JP;NAKAJIMA, ATSUO, YUKI-GUN, IBARAKI-KEN, JP;TSUKAGOSHI, ISAO, SHIMODATE-SHI, JP;OHTA, TOMOHISA, SHIMOTSUGA-GUN, TOCHIGI-KEN, JP;YAMAGUCHI, YUTAKA, YUKI-SHI, JP
分类号 H01R43/00;H05K3/22;H05K3/28;H05K3/32;H05K3/36;(IPC1-7):H05K3/22 主分类号 H01R43/00
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