| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive epoxy resin composition which can give a cured product excellent in thermal conductivity, electrical conductivity and stress characteristics and can be desirably used as a die bonding material in the semiconductor industries. SOLUTION: This electroconductive epoxy resin composition comprises an epoxy resin, a curing agent and an inorganic filler, wherein the inorganic filler comprises particles prepared by applying or sticking silver to the surface of a powder of an oxide, a composite oxide or a nitride of at least one metallic element selected from among Al, Si, B and Mg. |
