PRINTED CIRCUIT BOARD INTERCONNECTION BETWEEN LAYERS

摘要

A micro filled material (801) includes a binding material (802) and optionally includes a number of particles (803). The binding material (802) and the particles (803) can be formed of any conductive or nonconductive material. Using such a micro filled via material (801), an electrical conductor is formed in a substrate (825) for supporting one or more electronic components using the following steps: placing the micro filled via material (801) between two conductive layers (810, 820) at various locations in a substrate (825) at which an electrical conductor is to be formed; and optionally programming the micro filled via material (801) to reduce the resistance of, or to form an electrical conductor.