| 摘要 |
PROBLEM TO BE SOLVED: To realize sufficient characteristics of a multilayer printed wiring board through rigid close contactness between undercoat agent and copper foil without execution of blackening process to an internal layer circuit copper foil. SOLUTION: In this method of manufacturing a multilayer printed wiring board in which a prepreg obtained by impregnating a thermosetting resin into a base material and then drying the resin is laminated to a single-surface or double-surface copper laminated board process as a circuit and these plate and prepreg are pressed, an undercoat agent including, as the main elements, (1) direct chain type epoxy resin having two functions at the terminal having average epoxy equivalent of 450-6000, (2) aromatic polyamine and (3) one or more kinds of 2-undecylimidazole, 1-cyanoethyl-2-undecylimidazole and 2,4- diamino- 2'-undecylimidazole(1')} ethyl-s-triazine as the hardening accelerating agent is applied and dried on the copper laminated circuit board. Thereafter, a prepleg obtained by impregnating epoxy resin into a base material and then drying the base material is laminated and are then pressed on the copper laminated circuit surface. |
