发明名称 |
Leiterrahmen für Halbleiteranordnung |
摘要 |
A lead frame for a semiconductor device having: first and second frame portions (1, 1) facing each other and spaced apart by a predetermined distance; an island (4) formed at a position sandwiched between the first and second frame portions (1, 1) for mounting a semiconductor chip; a pair of tie bars (22, 22) for integrally coupling the first frame portion (1) and a side of the island (4) facing the first frame portion, the pair of tie bars (22, 22) being formed with a predetermined space in the widthwise direction; and a pair of tie bars (22, 22) for integrally coupling the second frame portion (1) and a side of the island (4) facing the first frame portion, the pair of tie bars (22, 22) being formed with a predetermined space in the widthwise direction. <IMAGE> |
申请公布号 |
DE69125200(T2) |
申请公布日期 |
1997.08.07 |
申请号 |
DE1991625200T |
申请日期 |
1991.04.17 |
申请人 |
KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP |
发明人 |
TAKAHASHI, KENJI, OOITA-SHI, OOITA-KEN, JP;ASADA, JUNICHI;HAYASHI, KAZUNORI |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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