| 摘要 |
PURPOSE:To shorten the width of a head to achieve miniaturization by shortening the width of an insulating substrate without shortening the width of a connection electrode, by also arranging a part of the connection electrode to the surface having no heat generating resistor arranged thereto of the insulating substrate. CONSTITUTION:A transfer sheet 22 has a two-layered structure constituted of a connection electrode 22A and an abrasion resistant layer 22B, and adhered to the terminal parts of common electrodes 21-1,... 21-N,... and the peripheral surface of an alumina ceramic substrate on the side of the connection electrode 22A by thermal press bonding. That is, in this thick thermal head 20, the greater part of the transfer sheet 22 is arranged to the other surface of the alumina ceramic substrate 2 in a folded state and the width of the alumina ceramic substrate 2 can be shortened. By this method, the distance between the end surface of the alumina ceramic substrate 2 and a heat generating resistor 5 can be set within 1 mm and the width of the thick film thermal head 20 can be shortened by 2 mm or more. |
