| 摘要 |
The method involves signal transmission through an approximately coaxial three-dimensional structure formed by two pairs of conductors (18d,18g;19d,19g) at different fixed potentials and having a substantially constant characteristic impedance. Conductors are arranged at different levels (N1-N6), the outer ones (N1,N6) constituting opposite faces of a frame (13). The coaxial structure extends as near as possible to the outer terminals of the package and to those (12) of the integrated circuit (11). The levels of the conductors are separated by insulating layers (I1-I5). |
