| 摘要 |
PROBLEM TO BE SOLVED: To provide the wafer processing unit in which undesired gaps in its tank and consequent flow of processing liquid are eliminated, the size is made small and the processing effect of wafers is improved. SOLUTION: A unit 30 is provided with a processing tank 31 of double tank structure where a processing liquid is injected from a bottom side of an inner tank 31-1 and the processing liquid overflows from the inner tank 31-1 into an outer tank 31-2. In this case, the unit 30 is provided with a wafer carrying tub 32 that is inserted to the processing tank 31, whose bottom face and upper face are open, whose outer circumferential wall at its entire part or at its lower end part at least is in contact with an internal circumferential wall of the inner tank 31-1 and that receives the entire flow of the processing liquid at its inside, the processing tank 31 is designed to eliminate undesired gaps and the resulting liquid flow, all or part of the circumferential wall of the processing tank 31 is tilted to reduce friction between the processing tank 31 and the wafer carrying tub 32. Moreover, a rugged guide is provided to the wafer carrying tub 32 and the processing tank 31 to improve the work efficiency.
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