| 摘要 |
A method for protecting substrates used in the manufacture of semiconductors, memory products, and other electronic devices from the effects of moisture during transport and storage is disclosed. This method involves the use of a cassette or box made from polycarbonate or another material having similar hydroscopic properties, treating the cassette or box to reduce its moisture content, and surrounding the cassette or box, and the substrates held therein, with a moisture barrier. This results in a package which will keep the substrates dry and eliminates the need for a separate desiccant within the package.
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