发明名称 |
Chemisch-mechanische Poliervorrichtung für Halbleiterwafer |
摘要 |
A chemical mechanical polishing apparatus for a semiconductor wafer which is capable of polishing uniformly the surface of the semiconductor wafer and of controlling the polishing amount by providing plurality of rotary drums each wrapped in a polishing cloth on the upper surface of a polishing pad and connecting supporters capable of vertical movement to both ends each rotary drum, and includes a rotatable polishing pad in the planar upper surface of which a plurality of recesses are formed for receiving a semiconductor wafer, a plurality of rotatable polishing units located on the polishing pad for planarizing the surface of the semiconductor wafers, a supporter connected at the endpoints of the rotational polishing units which can make a vertical movement, and a slurry applicator located above the rotational polishing units for putting a slurry thereon. |
申请公布号 |
DE19648066(A1) |
申请公布日期 |
1998.01.22 |
申请号 |
DE1996148066 |
申请日期 |
1996.11.20 |
申请人 |
LG SEMICON CO., LTD., CHEONGJU, KR |
发明人 |
KIM, YOUNG-KWON, CHEONGJU, KR;JUN, YOUNG-KWON, SEOUL/SOUL, KR |
分类号 |
B24B37/00;B24B37/04;B24B37/10;B24B37/20;B24B37/24;B24B41/04;H01L21/304;(IPC1-7):H01L21/302 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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