| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor package by which a plurality of terminal electrode parts and contact pins can be electrically connected with high reliability, by a method wherein the respective terminal electrode parts for contact are provided with a guide mechanism for positioning with reference to the contact pins at a socket. SOLUTION: In a guide block 2 as a guide mechanism, guide holes 21 as opening, i.e., as head-cut conical openings, having taper-shaped inner side faces used to guide contact pins 7 so as to match positions of lands 1 are formed, and the guide block is attached to the rear surface of a package 3 by an adhesive. When the package 3 is inserted into a socket 8 and when the mutual dislocation of the socket 8 from the package 3 is generated, the contact pins 7 are guided by the taper-shaped inner side faces at the guide holes 21, the contact pins 7 themselves are tilted a little within the range of the sliding margin of the contact pins 7 so as to absorb the dislocation, and the normal electric contact of terminal electrodes with the contact pins is held. |
