发明名称 MOUNTING STRUCTURE FOR SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure by which the connection of an external application circuit to a multisize sensor can be performed simply and surely via a general connector, for a board, of high reliability in a sensor (the multisize sensor) devised to generate an output according to a pressurization position when a beltlike sensor face is pressurized partially. SOLUTION: A slender printed-wiring board 4 of large rigidity is used as a board, slender sheetlike sensors 6, 7, 8 which are shorter than the board are bonded onto the board, wiring patterns which are printed and formed on one end side of the printed-wiring board 4 are connected to wiring patterns of the sheetlike sensors, and a connector, for a board, which is connected to the printed patterns of the printed-wiring board 4 is mounted on one end part of the printed-wiring board.
申请公布号 JPH10103911(A) 申请公布日期 1998.04.24
申请号 JP19960275298 申请日期 1996.09.27
申请人 OMRON CORP 发明人 HANAKI KAZUHIKO;TANAKA TOSHIHIDE
分类号 G01B7/00;G01B21/00;G01D5/16;(IPC1-7):G01B7/00;H01R23/68 主分类号 G01B7/00
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