| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an integrated circuit easy to evaluate its bond condition. SOLUTION: Two external connecting electrodes 12 are provided on the surface of a chip 11, via-holes 13 are formed in their lower parts, and conductors 14 are formed in the via-holes 13. On the back surface of the chip 11 a first metal film 15 is formed, a second metal film 19 is formed on the surface of a ceramic substrate 18, and both are contacted and heated to bond the chip 11 to the substrate 18. Before forming the first film, slits 16 have been provided without the first metal film. At evaluating the bonding condition, the resistance between the two external connecting electrodes 12 is measured. |
