发明名称 |
Electronic circuit with integrated terminal pins |
摘要 |
Thin circuit pathways of an electronic circuit are integral with thick terminal pins. The thin and thick portions are stamped, formed and chemically etched from a single sheet of copper or copper alloys, and mounted on a substrate to eliminate the need of a separate header. Components are soldered to the thin pathways in the conventional manner and a housing is molded to the circuit or a preformed housing is attached to the circuit. In another embodiment, a filtered header which contains thin circuit pathways integral with thick terminal pins is formed in the same manner and includes filtering components.
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申请公布号 |
US5774342(A) |
申请公布日期 |
1998.06.30 |
申请号 |
US19960721396 |
申请日期 |
1996.09.26 |
申请人 |
DELCO ELECTRONICS CORPORATION |
发明人 |
BRANDENBURG, SCOTT DAVID;DAANEN, JEFFERY RALPH |
分类号 |
H01L23/498;H01L25/16;H05K3/40;(IPC1-7):H01R13/08 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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