| 摘要 |
A device for transporting a die from a die pick-up position to a die placement position in the process of manufacturing, for instance, semiconductor devices, including a slider which is vertically movable, a suction holding nozzle installed on the slider, a feeder screw which causes a horizontal movement of the slider, a transport guide shaft which guides the slider so as to make its horizontal movement, a pair of pivotal swing levers respectively installed above the die pick-up position and the die placement position so as to guide the slider to ascend and descend, and driving cams which cause the pivot motions of the swing levers.
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