发明名称 BOILING COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a boiling cooling device in which the heat radiating area of a condensing section can be made larger as compared with the whole physical constitution of the device and which can be assembled easily. SOLUTION: In a boiling cooling device, a coolant tank 3 and bursting tubes 4 are respectively formed of extruded sections and arranged in nearly parallel with each other in the same direction. The tubes 4 constitute a condensing section together with heat radiating fins 5 and the tubes 4 and fins 5 are alternately piled upon another in a plurality of stages. Headers 6 are composed of a header 6A to which one opened end sections of the tank 3 and tubes 4 are assembled and another header 6B to which the other opened end sections 3 of the tank 3 and tubes 4 are assembled. Each header 6 is formed in a flat hollow shape by only joining the peripheries of two plate members 6 press- worked in rectangular shapes to each other and one plate member 6b has openings into which the opened end sections of the tank 3 and tubes 4 are inserted.
申请公布号 JPH10335552(A) 申请公布日期 1998.12.18
申请号 JP19970141301 申请日期 1997.05.30
申请人 DENSO CORP 发明人 KAWAGUCHI SEIJI;TERAO MASAYOSHI;TANAKA KOJI;KOBAYASHI KAZUO
分类号 H05K7/20;H01L23/427;(IPC1-7):H01L23/427 主分类号 H05K7/20
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