| 发明名称 |
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A printed circuit board, a semiconductor package, and a method of producing the same are provided. The printed circuit board (PCB) includes an insulating layer and a circuit layer including metal pads exposed on a side surface and a lower surface of the insulating layer. |
| 申请公布号 |
US2016353572(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615016136 |
申请日期 |
2016.02.04 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LIM Jae Hyun;KIM Jong Man;KIM Jin Su;PARK Heung Woo;KIM Sun Ho;CHOI Jung Gon |
| 分类号 |
H05K1/11;H05K3/46;H05K1/02 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board (PCB) comprising:
an insulating layer; and a circuit layer comprising metal pads exposed on a side surface and a lower surface of the insulating layer. |
| 地址 |
Suwon-si KR |
