| 发明名称 |
RESIN COMPOSITION FOR PACKAGING AND PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
A resin composition for packaging, an insulating film and a printed circuit board manufactured with the resin composition, and a method of manufacturing a printed circuit board with the resin composition are provided. The resin composition for packaging includes an epoxy resin, and inorganic filler particles dispersed in the epoxy resin, and an aspect ratio of the inorganic filler particles is 1.0 or more and 3.0 or less. |
| 申请公布号 |
US2016353570(A1) |
申请公布日期 |
2016.12.01 |
| 申请号 |
US201615136231 |
申请日期 |
2016.04.22 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Sung Chul |
| 分类号 |
H05K1/03;C08K3/36;H05K3/10;C08K3/26;C08J5/18;C08K7/00;C08K3/40 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A resin composition for packaging, comprising:
an epoxy resin; and inorganic filler particles dispersed in the epoxy resin, wherein an aspect ratio of the inorganic filler particles is 1.0 or more and 3.0 or less. |
| 地址 |
Suwon-si KR |
