| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor mounting board which can be mounted on a motherboard, improved in electrical reliability, and improved in connection reliability when it is mounted on the motherboard. SOLUTION: A recess 11 is provided to the rear center of an insulating board 10. An edge electrode 13 is provided to each edge face of the insulating board 10 spreading in the thickness direction of the board 10, surface circuits 14 each connected to the edge electrodes 13 are provided to the surface of the board 10 extending from the edges toward center of the board 10, and back electrodes 15 each of which connected to the edge electrodes 13 are formed on the rear of the board 10. A resist 5 is provided to the surface of the insulating board 10 for covering the surface of the surface circuits 14 with the center and edges of the board 10 left exposed. The length A of an exposed part between the end of the resist 5 and the edge of the board 10 is set larger than a length B of the back electrode 15, which extends from the edge of the board to its other edge.
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