发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To reduce electromagnetic-wave radiation noises emitted from a multilayer printed wiring board. SOLUTION: In the multilayer printed wiring board, a power supply layer 13 with a 5 V power-supply plane 14 and 3.3 V power-supply planes 15a, 15 are mutually installed oppositely to a ground layer (not shown) formed in a single plane shape. A wiring pattern 4b for a 5 V clock signal for transmitting a signal as an electromagnetic-wave radiation noise source is formed between the mutual 3.3 V power-supply planes 15a, 15b divided into two in the power supply layer 13. Accordingly, the current passage of a return current flowed through the ground layer is formed in a shortest straight line shape, and electromagnetic-wave radiation noises emitted from the multilayer printed wiring board can be reduced.
申请公布号 JPH11214809(A) 申请公布日期 1999.08.06
申请号 JP19980013981 申请日期 1998.01.27
申请人 CANON INC 发明人 TAKEUCHI YASUSHI
分类号 H05K1/00;H05K1/02;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/00
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