| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor module which has a ceiling plate having barriers and a flat surface at low cost. SOLUTION: A power semiconductor module is constituted of a metal base, a power semiconductor chip formed on the metal base, outside lead-out terminals connected electrically with the power semiconductor chip, a case which is adhered to the metal base, has an aperture part from which the outside lead-out terminals are led out to the outside, and has a window between the outside lead-out terminals, and a sealing material which is injected from the window and with which a chip is sealed. A ceiling plate 31, where barriers 32 arranged between the terminals are installed on one surface, and the other surface is flat is arranged on the window. |
