SINGULATION MOLDING METHOD OF F-BGA AND MOLDING DEVICE THEREOF

摘要

PURPOSE: A singulation molding method of F-BGA and a molding device thereof are provided to improve the work efficiency, to enable to apply to the vehicle equipment. CONSTITUTION: F-BGA(FLUX-BALL GRID ARRAY) comprises: a cutting punch unit(110); an upper mold(100) each equipped with a pushing punch unit(120) forming a striper(112'); a lower mold(200) installed in the location corresponding to the pushing punch unit(120) of the upper mold(100); a discharging device(300) for discharging the semiconductor package of the F-BGA cut and separated into a discharge track(320).